3N80 Amps, Volts N-channel Power Mosfet. DESCRIPTION. The UTC 3N80 uses advanced trench technology to provide excellent RDS(ON), low gate . 3NTF3-T Amps, Volts N-channel Power Mosfet. DESCRIPTION. The UTC 3N80 uses advanced trench technology to provide excellent RDS(ON), low . 3N80 Datasheet PDF Download – N-Channel MOSFET Transistor, 3N80 data sheet.

Author: Jutilar Volrajas
Country: China
Language: English (Spanish)
Genre: Education
Published (Last): 28 June 2009
Pages: 423
PDF File Size: 6.39 Mb
ePub File Size: 11.39 Mb
ISBN: 272-1-31502-278-8
Downloads: 96480
Price: Free* [*Free Regsitration Required]
Uploader: Gozilkree

Whatever your manufacturing need, come to 33n80 to buy electric components from the leading electronic component distributors and electronic component suppliers! There are tradeoffs to be made between RDS on that requires shorter channel lengths and punch-through avoidance that requires longer channel lengths.

Finally the lower the gate oxide thickness the higher gfs. Transconductance is influenced by gate width, which increases in proportion to the active area as cell density increases. Despite the very advanced state of manufacturability and if costs of BJTs, these limitations have made the base drive circuit design more complicated and hence more expensive than the power MOSFET. Reduced channel length is beneficial to both gfs and on-resistance, with punch-through as a tradeoff.

Consignment and warehousing available.

elpro Elektronik

When a voltage ramp appears across the drain and source terminal of the device a current I1 flows through the gate resistance, RG, by means of the gate-drain capacitance, CGD. These are normally negligible in high voltage devices but can become significant in low voltage devices.

Typical values of input Cissoutput Coss and reverse transfer Crss capacitances given in the data sheets are used by circuit designers as a starting point in determining circuit component values. Another BJT limitation is that both electrons and holes contribute to conduction. The substrate contribution becomes more significant for lower breakdown voltage devices. Plus, they can withstand Maximum Orf A simultaneous application of high current and voltage without Figure 2. CGD is also called the Miller capacitance because it causes the total dynamic input capacitance to become 3j80 than the sum of the 3j80 capacitances.


Also, BJTs suffer from thermal runaway. The base resistance RB must be minimized through careful design of the doping and distance under the source region. Their forward voltage drop decreases with increasing temperature causing diversion of current to a single device when several MOS devices irrf paralleled.

The data sheet capacitances are defined ifr terms of the equivalent circuit capacitances as: We are well known for our great prices, great selection, and as the leading online source for hard-to-find and hard-to-buy electronic component parts. The parasitic JFET n380 between the two body implants restricts current flow when the depletion widths of the two adjacent body diodes extend into the drift region with increasing drain voltage.

This capacitance gives rise to a current I 2 to flow through the base resistance RB when a voltage ramp appears across the drain-source terminals.

Although it is not possible to define absolutely the operating boundaries of a power device, we will loosely refer to the power device as any device that can switch at least 1A. These simple calculations would not have been possible with input capacitance values.

(PDF) 3N80 Datasheet download

Power Transistors RF Transistor. This parameter is normally quoted for a Vgs that gives a drain current equal to about one half of the maximum current rating value and for a VDS that ensures operation in the constant current region.


Good circuit design practice dictates the use of a higher gate voltage than the bare minimum required for switching and therefore the gate charge used in the calculations is QG corresponding to t4. Over time, new materials, structures and processing techniques are expected to raise these limits.

In addition, we provide excess inventory consignment, electronic engineering and product design services, prototyping, contract manufacturing, handheld portable computing products, and software application development services. Power mosfet basics IR RG is the total gate resistance in the circuit and the voltage drop across it is given by: The reach-through phenomenon occurs when the depletion region on the drift side of the body-drift p-n junction 3h80 the epilayer-substrate interface before avalanching takes place in the epi.

Figure 10 shows a typical I-V characteristics for this diode at two temperatures. A large base drive current as high as one-fifth of the collector current is required to keep the device in the ON state. Vth is usually measured at a drain-source current of ?

They 0 are superior to the BJTs in high frequency applications where 1 10 switching power losses are important. For drain voltages below BVDSS and with no bias on the D gate, no channel is a formed under the gate at the surface and the drain Source Source voltage is entirely Gate supported by the reverse-biased body-drift p-n junction.